Fusion PCB Specification
- PCB Gerber
Gerber files should be inside a .rar or.zip archive with standard file extensions:
Extension Layer
- pcbname.GTL Top Copper
- pcbname.GTS Top Soldermask
- pcbname.GTO Top Silkscreen
- pcbname.GBL Bottom copper
- pcbname.GBS Bottom Soldermask:
- pcbname.GBO Bottom Silkscreen:
- pcbname.TXT Drills
- pcbname.GML/GKO Board Outline
- pcbname.GL2 Inner Layer2( for ≥4 layer)
- pcbname.GL3 Inner Layer3( for ≥4 layer)
Notes:
1. Gerber file must be the RS-274x format
2. Drill file(PCBname.TXT) should be Excellon format
3. Gerber file and Drill file(PCB name.TXT) must be put in the same folder
4. Board outline is required
- PCB Specification for FR4-TG130
Items | Description | Specs |
Unit: mm | ||
Board Dimension | Min size | 10mm*10mm |
Max size | 500*500mm | |
Available Board Layers | 1-6 layers | |
Available Board Qty | Min:5pcs | |
Max: 8000pcs | ||
Dielectric Constant | 4.2-4.7 | |
Dielectric Separation thickness | 0.075 - 5.0 | |
Available Board Thickness | 1-2 layers | 0.6, 0.8, 1, 1.2, 1.6, 2, 2.5, 3 |
4 layers | 0.8, 1, 1.2, 1.6, 2, 2.5, 3 | |
6-8 layers | 1, 1.2, 1.6, 2, 2.5, 3 | |
10 layers | 1.2, 1.6, 2, 2.5, 3 | |
12 layers | 1.6, 2, 2.5, 3 | |
14 layers | 2, 2.5, 3 | |
16 layers | 2.5,3 | |
Available Board Copper Weigh | 1oz. 2oz. 3oz. | |
Board Thickness Tolerance | ± 10% | |
Minimum trace spacing / width | ![]() ![]() | For 1oz, 4/4mil, 5/5mil, 6/6mil For 2oz, 10/10mil For 3oz, 15/15mil |
Minimum trace width in inner layers (for 4 layers board) | ![]() ![]() | ≥6mil |
Minimum distance between trace and copper pour | ![]() | For 1oz ≥ 8mil For 2oz ≥ 12mil For 3oz ≥ 15mi |
Minimum distance between vias (plated holes) | ![]() | ≥12mil |
Minimum distance between via(plated holes) and trace |
![]() | ≥12mil |
Annular Rings | ![]() |
≥0.152mm/6mil |
Outer Layer Copper Thickness | ![]() | 0.035-0.07(1oz-2oz) |
Inner Layer Copper Thickness | ![]() | 0.017(0.5oz) |
Drilling Hole Diameter(Mechanical) | 0.2 - 6.3mm | |
Width of Solder Mask Dam | ![]() |
Normal: ≥0.32mm for Green ≥0.35mm for Other colors Limitation(need extra fee): ≥0.10mm for Green ≥0.13mm for Other colors |
Diameter of Castellated Holes | ≥0.50mm |
|
Size of BGA | ![]() |
For 6/6mil ≥0.45mm For 5/5mil ≥0.35mm For 4/4mil ≥0.25mm |
Circuit to edge | ![]() | ≥0.3mm |
Minimum distance between inner trace and non-plated hole | ![]() | ≥0.2mm/7.87mil |
Minimum silkscreen height/trace width | ![]() | height ≥0.5842mm /23mil trace width ≥0.1016mm /4mil |
Perfect aspect ratio of silkscreen | 1:5 |
|
Silkscreen colour | Silkscreen colour is WHITE when solder mask is Green, Red, Yellow, Blue, Black Silkscreen colour is BLACK when solder mask is white |
|
Minimum distance between pad and silkscreen |
![]() | ≥0.1524mm/6mil |
Minimum milling slot width | ≥0.8mm | |
Slot Tolerance(Mechanical) | ±0.15mm | |
The minimum board dimension of V-CUT | The V-cut line only is cut from edge to edge |
≥70*55mm |
The maximum board dimension of V-CUT | ≤380*380mm | |
The minimum sub-board dimension of V-CUT | ≥8*8mm |
|
PCB production time(build time) |
3-14 working days * PCB production time takes 3 - 14 working days depending on specific order parameters. |
Aluminum Board Specification | |
Layer: | 1 |
Available Board Thickness: | 1mm, 1.2mm, 1.6mm, 2mm |
QTY | min: 5, max: 8000 |
Board Dimension: | min: 10mm*10mm |
max: 500*500mm | |
Available Board Colour: | White (Silkscreen is black) |
Black (Silkscreen is white ) | |
Copper weight: | 1oz |
Surface Finish: | HASL, HASL lead-free, ENIG, OSP,Hard Gold |
Minimum Trace Width: | 4mil |
Minimum Trace Spacing: | 4mil |
Minimum Drilling Hole: | 0.2mm |
Production Lead Time: | 5-11 business days |
FPC Board Specification | |
Layer: | 1,2 |
Available Board Thickness: | 0.1mm,0.15mm |
QTY within: | min:5,max:8000 |
Board Dimension: | max:100mm*100mm |
Available Board Colour: | Yellow |
Silkscreen: | White |
Copper weight: | 0.5oz |
Surface Finish: | ENIG |
Minimum Trace Width: | 0.10mm |
Minimum Trace Spacing: | 0.10mm |
Minimum Drilling Hole: | 0.3mm |
Production Lead Time: | 5-7 working days |
The temperature of FPC | Low-temperature resistance:-40℃ High-temperature resistance:280℃ |
- Panelization Rules:
Please click here for more details.
