Fusion PCB Specification
PCB Gerber Files
Extension Layer
- pcbname.GTL Top Copper
- pcbname.GTS Top Soldermask
- pcbname.GTO Top Silkscreen
- pcbname.GBL Bottom copper
- pcbname.GBS Bottom Soldermask:
- pcbname.GBO Bottom Silkscreen:
- pcbname.TXT Drills
- pcbname.GML/GKO Board Outline
- pcbname.GL2 Inner Layer 2 (for ≥ 4 layer)
- pcbname.GL3 Inner Layer 3 (for ≥ 4 layer)
Notes:
1. Gerber files should be in RS-274X format (RS-274D is not recommended due to issues reading the files).
2. Drill file (PCBname.TXT) should be in Excellon format.
3. Gerber file and Drill file (PCB name.TXT) should be included in the same folder.
4. The board outline is required, ideally in an isolated mechanical layer.
Standard Seeed Fusion PCB Service Specification
Items | Description | Specs |
Units: mm or mil as specified | ||
Board Dimension | Min size | 10 x 10 mm |
Max size | 500 x 500 mm |
|
Tolerance | ± 0.2 mm |
|
Available Board Layers | 1-6 layers | |
Available Board Qty | Minimum | 5 pieces |
Maximum | 8000 pieces | |
Dielectric Constant | 4.2 - 4.7 | |
Dielectric Separation thickness | 0.075 - 5.0 | |
Available Board Thicknesses (mm) | 1 and 2 layers | 0.6, 0.8, 1, 1.2, 1.6, 2, 2.5, 3 |
4 layers | 0.8, 1, 1.2, 1.6, 2, 2.5, 3 | |
6 and 8 layers | 1, 1.2, 1.6, 2, 2.5, 3 | |
10 layers | 1.2, 1.6, 2, 2.5, 3 | |
12 layers | 1.6, 2, 2.5, 3 | |
14 layers | 2, 2.5, 3 | |
16 layers | 2.5, 3 | |
Tolerance | ± 10%, ± 0.1mm for ≤ 1 mm thicknesses | |
Available Board Copper Weights | | 1 oz. 2 oz. 3 oz. |
Surface Finish Options | | HASL*, HASL lead-free, ENIG, OSP, Hard Gold *Contains lead, not RoHS compliant. All others are RoHS compliant. |
Minimum trace spacing / width | [Spacing/Width] mil For 1 oz: 4/4 mil, 5/5 mil, 6/6 mil For 2 oz: 10/10 mil For 3 oz: 15/15 mil *Minimum trace/width spacing for RF coil designs is 6/6 mil, but please select the 4/4 mil option. |
|
Minimum trace width in inner layers (for 4 layers board) | 0.15mm (6 mil) | |
Minimum distance between plated holes (To prevent ion migration) |
Vias: 0.3mm (12 mil) Plated through-holes: 0.45mm (18 mil) |
|
Minimum distance between plated holes and traces |
≥ 12 mil |
|
Annular Rings | ≥ 0.1 mm (4 mil) for vias ≥ 0.152 mm (6 mil) for PTH |
|
Outer Layer Copper Thickness | 0.035 - 0.07 mm (1 oz - 2 oz) | |
Inner Layer Copper Thickness | 0.017 mm (0.5 oz) | |
Drill Hole Diameter (NPTH) | 0.2 - 6.3 mm (larger sizes will be milled) | |
Size Tolerance | ± 0.05 mm | |
Position Deviation | ± 0.05 mm | |
Plated Hole Diameter | Via Holes | 0.2 - 0.5 mm (0.3mm and smaller vias can guarantee full solder mask tenting) |
Plated Through Holes (PTH) | 0.2 - 5.8 mm (larger sizes not guaranteed) | |
Castellated Holes (Plated Half-Holes) | ≥ 0.50 mm | |
Size Tolerance |
± 0.075 mm | |
CNC Milling/Routing | Non-Plated Milling Slot Width | ≥ 0.8 mm |
Plated Milling Slot Width | ≥ 0.65 mm | |
Milling/Routing Tolerance | ± 0.15 mm | |
Width of Solder Mask Dam | Normal: ≥ 0.32 mm for Green≥ 0.35 mm for Other colors Please select 0.1mm option: ≥ 0.10 mm for Green ≥ 0.13 mm for other colors |
|
BGA size | ≥ 0.45 mm pitch BGAs (select 6/6 mil trace width/spacing) ≥ 0.35 mm pitch BGAs (select 5/5 mil trace width/spacing) ≥ 0.25 mm pitch BGAs (select 4/4 mil trace width/spacing) |
|
Circuit to edge | ≥ 0.3 mm | |
Minimum distance between inner trace and plated holes | ≥ 0.2 mm / 7.87 mil | |
Minimum silkscreen height/trace width | Height ≥ 0.5842 mm / 23 mil Trace width ≥ 0.1016 mm / 4 mil *Smaller widths are possible but we cannot guarantee print quality. |
|
Ideal silkscreen aspect ratio | 1:5 |
|
Silkscreen color | Silkscreen color is WHITE when solder mask is Green, Red, Yellow, Blue, Black Silkscreen color is BLACK when solder mask is white |
|
Pad to Silkscreen Clearance |
≥ 0.1524 mm / 6 mil | |
V-Cut / V-Score / V-Groove (V-cut lines must go across the entire length of the boards, i.e. no jump cuts.) |
Board Length (both sides) | 55 to 380 mm |
Sub-Board Dimensions | ≥ 8 x 8 mm |
|
V-Cut Line Width | 0.4 mm |
|
PCB production time (build time) |
3 - 14 working days *Depends on specific order parameters as calculated on the order form |
No. of Circuit Layers | 1 |
Available Board Thicknesses | 1 mm, 1.2 mm, 1.6 mm, 2 mm |
Quantity | min: 5, max: 8000 |
Board Dimensions | min: 10 x 10 mm |
max: 500 x 500 mm | |
Available Board Colors | White (Silkscreen is black) |
Black (Silkscreen is white) | |
Copper weight | 1 oz |
Surface Finish | HASL*, HASL lead-free, ENIG, OSP, Hard Gold *Contains lead, not RoHS compliant. |
Minimum Trace Width/Spacing | 4/4 mil |
Minimum Trace Spacing | 0.2 mm |
Production Lead Time | 5 - 11 working days |
FPC Board Specification | |
Layer: | 1, 2 |
Available Board Thickness | 0.1 mm, 0.15 mm |
Quantity | min: 5, max: 8000 |
Board Dimension | max: 100 x 100 mm |
Solder mask color | Yellow |
Silkscreen color | White |
Copper weight | 0.5 oz |
Surface Finish | ENIG |
Minimum Trace Width | 0.10 mm |
Minimum Trace Spacing | 0.10 mm |
Minimum Drilling Hole | 0.3 mm |
Production Lead Time | 5 - 7 working days |
Temperature Range | -40℃ to 280℃ |
Please click here for more details.