Seeed Fusion Service offers one-stop prototyping service for PCB(printed circuit board) service, PCBA (PCB Assembly) service and other electronic and mechanical customized service (like CNC milling,3D printing, PCB layout service)

• pcbname.GTL               Top Copper 
• pcbname.GTS               Top Soldermask
• pcbname.GTO               Top Silkscreen
• pcbname.GBL                Bottom copper
• pcbname.GBS                Bottom Soldermask:
• pcbname.GBO                Bottom Silkscreen:
• pcbname.TXT                 Drills
• pcbname.GML/GKO        Board Outline
• pcbname.GL2                   Inner Layer2( for ≥4 layer)
• pcbname.GL3                   Inner Layer3( for ≥4 layer)

Notes:1. Gerber file must be the RS-274x format.  
         2. Drill file(pcbname.TXT) should be Excellon format.
         3. Gerber file and Drill file(pcb name.TXT) must be put in the same file.  
         4. Board outline is must


2. PCB Specification for FR4-TG130

Items	Description	Specs
		Unit: mm
Board Dimension	Min size	10mm*10mm Tip: If your board width is smaller than this size, you can make a bigger panel and use slots to separate the board.
	Max size	500*500mm
Available Board Layers	1-16 layers
Available Board Qty	Min：5pcs
	Max: 8000pcs
Dielectric Constant	4.2-4.7
Dielectric Separation thickness		0.075 - 5.0
Available Board Thickness	1-2 layers	0.6, 0.8, 1, 1.2, 1.6, 2, 2.5, 3
	4 layers	0.8, 1, 1.2, 1.6, 2, 2.5, 3
	6-8 layers	1, 1.2, 1.6, 2, 2.5, 3
	10 layers	1.2, 1.6, 2, 2.5, 3
	12 layers	1.6, 2, 2.5, 3
	14 layers	2, 2.5, 3
	16 layers	2.5,3
Available Board Copper Weigh	1oz.  2oz.  3oz.
Board Thickness Tolerance	± 10%
Minimum trace spacing / width		For 1oz, 4/4mil, 5/5mil, 6/6mil For 2oz, 10/10mil For 3oz, 15/15mil
Minimum trace width in inner layers (for 4 layers board)		≥6mil
Minimum distance between trace and copper pour		For 1oz     ≥8mil  For 2oz     ≥12mil   For 3oz     ≥15mi
Minimum distance between vias (plated holes)		≥12mil Aim to prevent Ion migration
Minimum distance between via(plated holes) and trace		≥12mil Aim to prevent Ion migration
Annular Rings		≥0.152mm/6mil
Outer Layer Copper Thickness		0.035-0.07(1oz-2oz)
Inner Layer Copper Thickness		0.017(0.5oz)
Drilling Hole Diameter(Mechanical)		0.2 - 6.3mm
Width of Solder Mask Dam		Normal: ≥0.32mm for Green ≥0.35mm for Other colors Limitation(need extra fee): ≥0.10mm for Green ≥0.13mm for Other colors
Diameter of Castellated Holes		≥0.50mm
Size of BGA		For 6/6mil ≥0.45mm For 5/5mil ≥0.35mm For 4/4mil ≥0.25mm
Circuit to edge		≥0.3mm
Minimum distance between inner trace and non-plated hole		≥0.2mm/7.87mil
Minimum silkscreen height/trace width		height ≥0.5842mm /23mil trace width ≥0.1016mm /4mil
Perfect aspect ratio of silkscreen	1：5
Silkscreen colour		Silkscreen colour is WHITE   when solder mask is Green, Red, Yellow, Blue, Black Silkscreen colour is BLACK when solder mask is white
Minimum distance between pad and silkscreen		≥0.1524mm/6mil
Minimum milling slot width		≥0.8mm
Slot Tolerance(Mechanical)		±0.15mm
The minimum board dimension of V-CUT	The V-cut line only is cut from edge to edge	≥70*55mm
The maximum board dimension of V-CUT		≤380*380mm
The minimum sub-board dimension of V-CUT		≥8*8mm
PCB production time(build time)	3-14 working days

3.Panelization Rules:

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