What PCB materials are available in Seeed Fusion?

For the standard PCB service, Fusion provides 3 options; FR-4 TG130, Aluminium and Flexible PCB materials. For most purposes, FR-4 TG130 is more than sufficient. If you are not sure which material you need, then FR-4 is most likely sufficient.

FR-4 TG130
FR-4 refers to a grade of epoxy fiberglass material where the FR stands for "flame retarding". The TG130 refers to the glass transition temperature and indicates that this material will begin to deform at 130 ℃. FR-4 is the most common substrate material for rigid PCBs, particularly prototypes. In the PCB, the pre-preg and core will be made of this material.

FR-4 materials with higher glass transition temperatures are available in the Advanced PCB service. High TG FR-4 (TG170) boards can withstand deformation at higher temperatures of up to 170 ℃ and are suitable for extreme temperature applications.



Aluminium
Aluminium boards are widely used in LED arrays and power converters due to good thermal dissipation properties of aluminium compared to FR-4. A thermally conductive but electrically insulating dielectric material is laminated between the copper and aluminium layers, and the exposed aluminium side helps to radiate the heat from the circuit. Such single layer PCBs are available in the standard PCB service but multilayer aluminium PCBs are also available in Fusion's Advanced service. However, the price escalates rapidly when increasing the number of layers and the boards cannot dissipate heat as well, so we recommend you try to reduce the number of layers as much as possible.

  

Flexible (FPC)
Flexible printed circuits, as the name suggests, are flexible alternatives to rigid PCBs that allow for greater freedom of movement and bendiness. Consisting of copper traces combined onto a thin dielectric material, flexible printed circuits can conserve space and be bent to fit into tight spaces and are suitable for applications involving vibrations or a certain degree of movement (e.g. connectors). Flexible printed circuits up to two layers are available in the standard service. If you need four layers or rigid-flex boards, you can try the advanced service. 



Fusion Technical Support

  1. What is Gerber file?
  2. What are the PCB panelization rules?
  3. How to generate the Gerber (manufacturing) files?
  4. What is the correct way to draw the silkscreen on the bottom side?
  5. My PCB does not require Solder Mask, what should I do?
  6. My PCB does not require Drill Holes, what should i do ?
  7. Which layer should I use in EAGLE for milling?
  8. What is the depth and width of the v-cuts/grooves?
  9. I don't want silkscreen on my PCBs, how can I proceed with a PCB Assembly order?
  10. What are the dimensions for Dielectric Separation thickness?
  11. What is the thickness of the inner copper layers?
  12. What are Blind and Buried Vias?
  13. What is the The Min Track/Spacing for 1oz./2oz./3oz. Copper weight
  14. What are Plated Half-Holes/Castellated Holes?
  15. How do I design non-plated through holes?
  16. What PCB materials are available in Seeed Fusion?
  17. What is the thickness of Fusion PCB?
  18. What PCB surface finishes are offered in Seeed Fusion?
  19. What color options are available for the solder mask/resist?
  20. What is the PCB copper weight?
  21. What is Impedance Control?
  22. PCB quantity
  23. How to generate Gerber files from PCBE
  24. How to generate Gerber files from Eagle
  25. How to generate Gerber files in Altium Designer
  26. How to generate Gerber files from CircuitMaker
  27. How to generate Gerber files from KiCAD
  28. How to generate Gerber files from DipTrace
  29. How to generate Gerber files from Proteus
  30. How to generate Gerber files from DesignSpark
  31. How to convert drilling layer from Gerber to Excellon format in CAM350
  32. Recommend size for BGA
  33. Solder Mask Dam
  34. What is the difference between Fusion standard PCB and Fusion Advanced PCB?
  35. What should I do if my Gerber files are too big (over 4MB)?

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